The ELIC board is a 6L rigid flex pcb with 1.2mm board thickness. Some distance between some PADs is so clsoe that we use red solder mask instead of coverlay. ELIC board is hard to produce, and ELIC rigid flex pcb is harder. For this harder board, we can provide you fast lead time: 5 day, in order to shorten the product's time to market.
Soldermask ink is applied over the whole PCB surface. Using artworks and UV light we expose certain areas to the UV and those areas not exposed are removed during the chemical development process – typically the areas which are to be used as solderable surfaces. The remaining soldermask is then fully cured making it a resilient finish. This step of the process is performed in a clean room.
Product Feature And Application
With PCBs containing even more layers and becoming thinner than ever before, new techniques are used to increase interconnect density. Every Layer Interconnect (ELIC) is one technology that lets designers create very thin, flexible PCBs with high functional density. These advanced HDI PCBs contain multiple layers of copper-filled stacked in-pad microvias that enable even more complex interconnections.
This multilayer printed circuit board is a 6 layer ELIC flex rigid pcb,used in industry control.The Flame Retardant Properties is V0.
● PCB factory passed UL, ISO90001: 2008 and ISO/TS16949: 2009 certification, which is the strong confidence for quality.
● The PCB products can be fully RoHS compliant ,and 100% guaranteed to meet IPC II standards.
● Strong process capability:
Max Layer Count: 36L Max Final Board Thickness: 7.0mm
Max PTH Aspect Ratio: 10:1 Max Finished Copper Thickness: 20 OZ
Max Panel Size: 622*610mm Min Line Width/ Space: 0.075/ 0.075mm